1N3041B-1
vs
1N3041BTRE3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-1
Reach Compliance Code
compliant
unknown
Factory Lead Time
14 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
175 Ω
175 Ω
JEDEC-95 Code
DO-41
DO-202AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Reference Voltage-Nom
75 V
75 V
Surface Mount
NO
NO
Technology
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
3.3 mA
3.3 mA
Base Number Matches
5
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Compare 1N3041B-1 with alternatives
Compare 1N3041BTRE3 with alternatives