1N3030CUR-1E3 vs MV1N3030CUR-1E3 feature comparison

1N3030CUR-1E3 Microsemi Corporation

Buy Now Datasheet

MV1N3030CUR-1E3 Microsemi Corporation

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DO-213AB
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Diode Type ZENER DIODE ZENER DIODE
Base Number Matches 10 2
Package Description O-LELF-R2
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
JEDEC-95 Code DO-213AB
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 1.25 W
Qualification Status Not Qualified
Reference Voltage-Nom 27 V
Surface Mount YES
Technology ZENER
Terminal Finish MATTE TIN
Terminal Form WRAP AROUND
Terminal Position END
Voltage Tol-Max 2%
Working Test Current 9.5 mA

Compare 1N3030CUR-1E3 with alternatives

Compare MV1N3030CUR-1E3 with alternatives