1N3023B-1
vs
MV1N3021CUR-1E3
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-1
|
O-LELF-R2
|
Reach Compliance Code |
compliant
|
unknown
|
Factory Lead Time |
14 Weeks
|
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED, HIGH RELIABILITY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
10 Ω
|
|
JEDEC-95 Code |
DO-41
|
DO-213AB
|
JESD-30 Code |
O-LALF-W2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e3
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
1 W
|
1.25 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
13 V
|
11 V
|
Surface Mount |
NO
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
WIRE
|
WRAP AROUND
|
Terminal Position |
AXIAL
|
END
|
Voltage Tol-Max |
5%
|
2%
|
Working Test Current |
19 mA
|
23 mA
|
Base Number Matches |
4
|
2
|
Part Package Code |
|
DO-213AB
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare 1N3023B-1 with alternatives
Compare MV1N3021CUR-1E3 with alternatives