1N3016B-1E3
vs
1N3016B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MOTOROLA INC
Package Description
HERMETIC SEALED, GLASS PACKAGE-1
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
3.5 Ω
3.5 Ω
JEDEC-95 Code
DO-41
DO-13
JESD-30 Code
O-LALF-W2
O-MALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
METAL
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Reference Voltage-Nom
6.8 V
6.8 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
PURE MATTE TIN
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
37 mA
37 mA
Base Number Matches
2
4
JESD-609 Code
e0
Knee Impedance-Max
700 Ω
Operating Temperature-Min
-65 °C
Qualification Status
Not Qualified
Reverse Current-Max
10 µA
Compare 1N3016B-1E3 with alternatives
Compare 1N3016B with alternatives