1N3011BE3
vs
1N3011B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-4
Package Description
O-MUPM-D1
HERMETIC SEALED, GLASS, DO-4, 1 PIN
Pin Count
1
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
PD-CASE
Case Connection
ANODE
ANODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
175 Ω
175 Ω
JEDEC-95 Code
DO-203AA
DO-203AA
JESD-30 Code
O-MUPM-D1
O-MUPM-D1
Number of Elements
1
1
Number of Terminals
1
1
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
POST/STUD MOUNT
POST/STUD MOUNT
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
10 W
10 W
Reference Voltage-Nom
150 V
150 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
PURE MATTE TIN OVER NICKEL
TIN LEAD OVER NICKEL
Terminal Form
SOLDER LUG
SOLDER LUG
Terminal Position
UPPER
UPPER
Voltage Tol-Max
5%
5%
Working Test Current
17 mA
17 mA
Base Number Matches
1
4
Factory Lead Time
35 Weeks
JESD-609 Code
e0
Qualification Status
Not Qualified
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Compare 1N3011B with alternatives