1N3006RB
vs
1N3006B
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description |
HERMETIC SEALED, GLASS, DO-4, 1 PIN
|
O-MUPM-D1
|
Reach Compliance Code |
compliant
|
unknown
|
Factory Lead Time |
35 Weeks
|
|
Case Connection |
CATHODE
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
45 Ω
|
45 Ω
|
JEDEC-95 Code |
DO-203AA
|
|
JESD-30 Code |
O-MUPM-D1
|
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
METAL
|
|
Package Shape |
ROUND
|
|
Package Style |
POST/STUD MOUNT
|
|
Polarity |
UNIDIRECTIONAL
|
|
Power Dissipation-Max |
10 W
|
10 W
|
Qualification Status |
Not Qualified
|
|
Reference Voltage-Nom |
105 V
|
105 V
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
SOLDER LUG
|
|
Terminal Position |
UPPER
|
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
25 mA
|
25 mA
|
Base Number Matches |
10
|
13
|
|
|
|
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