1N3006AE3
vs
1N3006B
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
NEW ENGLAND SEMICONDUCTOR
|
| Package Description |
O-MUPM-D1
|
HERMETIC SEALED, DO-4, 1 PIN
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ANODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-203AA
|
DO-4
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
10 W
|
10 W
|
| Reference Voltage-Nom |
105 V
|
105 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Voltage Tol-Max |
10%
|
5%
|
| Working Test Current |
25 mA
|
25 mA
|
| Base Number Matches |
1
|
13
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Dynamic Impedance-Max |
|
45 Ω
|
| Knee Impedance-Max |
|
1000 Ω
|
| Qualification Status |
|
Not Qualified
|
| Reverse Current-Max |
|
10 µA
|
| Voltage Temp Coeff-Max |
|
99.75 mV/°C
|
|
|
|
Compare 1N3006AE3 with alternatives