1N2999RCE3
vs
JAN1N2999C
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
O-MUPM-D1
|
O-MUPM-D1
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Case Connection |
CATHODE
|
ANODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-203AA
|
DO-203AA
|
JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
1
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Body Material |
METAL
|
METAL
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
10 W
|
10 W
|
Reference Voltage-Nom |
56 V
|
56 V
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
PURE MATTE TIN OVER NICKEL
|
TIN LEAD OVER NICKEL
|
Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
Terminal Position |
UPPER
|
UPPER
|
Voltage Tol-Max |
2%
|
2%
|
Working Test Current |
45 mA
|
45 mA
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
DO-4
|
Pin Count |
|
1
|
JESD-609 Code |
|
e0
|
Qualification Status |
|
Not Qualified
|
Reference Standard |
|
MIL-19500/124
|
|
|
|
Compare 1N2999RCE3 with alternatives
Compare JAN1N2999C with alternatives