1N2997RE3 vs JAN1N2997RB feature comparison

1N2997RE3 Microsemi Corporation

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JAN1N2997RB Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-MUPM-D1 HERMETIC SEALED, GLASS, DO-4, 1 PIN
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection CATHODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-203AA DO-203AA
JESD-30 Code O-MUPM-D1 O-MUPM-D1
Number of Elements 1 1
Number of Terminals 1 1
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT POST/STUD MOUNT
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 10 W 10 W
Reference Voltage-Nom 51 V 51 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form SOLDER LUG SOLDER LUG
Terminal Position UPPER UPPER
Voltage Tol-Max 20% 5%
Working Test Current 50 mA 50 mA
Base Number Matches 1 5
Pbfree Code No
Rohs Code No
Part Package Code DO-4
Pin Count 1
JESD-609 Code e0
Qualification Status Not Qualified
Reference Standard MIL-19500/124
Terminal Finish TIN LEAD

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