1N2977RE3
vs
UZ7713
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
O-MUPM-D1
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Case Connection |
CATHODE
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-203AA
|
|
JESD-30 Code |
O-MUPM-D1
|
O-MUPM-X1
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
1
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
METAL
|
METAL
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
10 W
|
10 W
|
Reference Voltage-Nom |
13 V
|
13 V
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
SOLDER LUG
|
UNSPECIFIED
|
Terminal Position |
UPPER
|
UPPER
|
Voltage Tol-Max |
20%
|
5%
|
Working Test Current |
190 mA
|
200 mA
|
Base Number Matches |
1
|
4
|
Rohs Code |
|
No
|
Factory Lead Time |
|
52 Weeks
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Dynamic Impedance-Max |
|
1.5 Ω
|
JESD-609 Code |
|
e0
|
Qualification Status |
|
Not Qualified
|
Reverse Current-Max |
|
50 µA
|
Reverse Test Voltage |
|
9.9 V
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 1N2977RE3 with alternatives
Compare UZ7713 with alternatives