1N2839RA
vs
1N3341DE3
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
MICROCHIP TECHNOLOGY INC
Package Description
O-MBFM-P2
HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
CATHODE
ANODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
25 Ω
JESD-30 Code
O-MBFM-P2
O-MUPM-D1
JESD-609 Code
e0
Knee Impedance-Max
210 Ω
Number of Elements
1
1
Number of Terminals
2
1
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
FLANGE MOUNT
POST/STUD MOUNT
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
50 W
50 W
Qualification Status
Not Qualified
Reference Voltage-Nom
105 V
105 V
Reverse Current-Max
5 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
PIN/PEG
SOLDER LUG
Terminal Position
BOTTOM
UPPER
Voltage Temp Coeff-Max
99.75 mV/°C
Voltage Tol-Max
10%
1%
Working Test Current
120 mA
120 mA
Base Number Matches
5
2
Additional Feature
PD-CASE
JEDEC-95 Code
DO-203AB
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