1N2828RD vs 1N3329RA feature comparison

1N2828RD Microsemi Corporation

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1N3329RA Microchip Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Part Package Code TO-3
Package Description HERMETIC SEALED, TO-3, 2 PIN HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection CATHODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code TO-204AD DO-203AB
JESD-30 Code O-MBFM-P2 O-MUPM-D1
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 1
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT POST/STUD MOUNT
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 45 V 45 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form PIN/PEG SOLDER LUG
Terminal Position BOTTOM UPPER
Voltage Tol-Max 1% 10%
Working Test Current 280 mA 280 mA
Base Number Matches 1 8
Additional Feature PD-CASE
Dynamic Impedance-Max 4.5 Ω
Knee Impedance-Max 100 Ω
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Dissipation-Max 50 W
Reverse Current-Max 10 µA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Temp Coeff-Max 40.5 mV/°C

Compare 1N2828RD with alternatives

Compare 1N3329RA with alternatives