1N2828RD
vs
1N3329RA
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
TO-3
Package Description
HERMETIC SEALED, TO-3, 2 PIN
HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
CATHODE
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
TO-204AD
DO-203AB
JESD-30 Code
O-MBFM-P2
O-MUPM-D1
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
1
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
FLANGE MOUNT
POST/STUD MOUNT
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
45 V
45 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
PIN/PEG
SOLDER LUG
Terminal Position
BOTTOM
UPPER
Voltage Tol-Max
1%
10%
Working Test Current
280 mA
280 mA
Base Number Matches
1
8
Additional Feature
PD-CASE
Dynamic Impedance-Max
4.5 Ω
Knee Impedance-Max
100 Ω
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Dissipation-Max
50 W
Reverse Current-Max
10 µA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Temp Coeff-Max
40.5 mV/°C
Compare 1N2828RD with alternatives
Compare 1N3329RA with alternatives