1N2825RA
vs
1N3326RDE3
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICROSEMI CORP
|
| Package Description |
O-MBFM-P2
|
O-MUPM-D1
|
| Reach Compliance Code |
unknown
|
compliant
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
3.5 Ω
|
|
| JESD-30 Code |
O-MBFM-P2
|
O-MUPM-D1
|
| JESD-609 Code |
e0
|
|
| Knee Impedance-Max |
90 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
1
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
FLANGE MOUNT
|
POST/STUD MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
50 W
|
50 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
36 V
|
36 V
|
| Reverse Current-Max |
5 µA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
PIN/PEG
|
SOLDER LUG
|
| Terminal Position |
BOTTOM
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Voltage Temp Coeff-Max |
30.6 mV/°C
|
|
| Voltage Tol-Max |
10%
|
1%
|
| Working Test Current |
350 mA
|
350 mA
|
| Base Number Matches |
5
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Additional Feature |
|
PD-CASE
|
| JEDEC-95 Code |
|
DO-203AB
|
|
|
|
Compare 1N3326RDE3 with alternatives