1N1189 vs 1N1189 feature comparison

1N1189 STMicroelectronics

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1N1189 Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer STMICROELECTRONICS MICROSEMI CORP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Additional Feature LEAKAGE CURRENT IS NOT AT 25 DEG C
Application GENERAL PURPOSE POWER
Case Connection CATHODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.5 V 1.7 V
JESD-30 Code O-MUPM-D1 O-MUPM-D1
Non-rep Pk Forward Current-Max 700 A 800 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 1 1
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -55 °C -65 °C
Output Current-Max 40 A 40 A
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT POST/STUD MOUNT
Power Dissipation-Max 44 W
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 500 V 500 V
Reverse Current-Max 500 µA
Surface Mount NO NO
Terminal Form SOLDER LUG SOLDER LUG
Terminal Position UPPER UPPER
Base Number Matches 2 8
Pbfree Code Yes
Rohs Code No
Part Package Code DO-5
Package Description METAL, DO-5, 1 PIN
Pin Count 1
JEDEC-95 Code DO-203AB
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare 1N1189 with alternatives

Compare 1N1189 with alternatives