1N1188APBFREE
vs
1N1188ATIN/LEAD
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
CENTRAL SEMICONDUCTOR CORP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Date Of Intro |
2018-07-13
|
2018-07-13
|
Application |
POWER
|
POWER
|
Case Connection |
CATHODE
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.1 V
|
1.1 V
|
JEDEC-95 Code |
DO-5
|
DO-5
|
JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
JESD-609 Code |
e3
|
e3
|
Non-rep Pk Forward Current-Max |
800 A
|
800 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
1
|
1
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Output Current-Max |
40 A
|
40 A
|
Package Body Material |
METAL
|
METAL
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
Reverse Current-Max |
100 µA
|
100 µA
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
Terminal Position |
UPPER
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Base Number Matches |
1
|
1
|
Package Description |
|
O-MUPM-D1
|
|
|
|
Compare 1N1188APBFREE with alternatives
Compare 1N1188ATIN/LEAD with alternatives