1894K-40LF
vs
SN65HVD233MDREP
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
VFQFPN
|
SOIC
|
| Package Description |
QFN-40
|
SOIC-8
|
| Pin Count |
40
|
8
|
| Manufacturer Package Code |
NLG40P1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
100000 Mbps
|
1000 Mbps
|
| JESD-30 Code |
S-XQCC-N40
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
6 mm
|
4.905 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
8
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC40,.24SQ,20
|
SOP8,.24
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.75 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
6 mm
|
3.895 mm
|
| Base Number Matches |
2
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Number of Channels |
|
1
|
| Supply Current-Max |
|
6 mA
|
|
|
|
Compare 1894K-40LF with alternatives
Compare SN65HVD233MDREP with alternatives