1893BKIT
vs
82562EZ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEL CORP
Part Package Code
DFN
BGA
Package Description
HVQCCN, LCC56,.31SQ,20
BGA,
Pin Count
56
196
Manufacturer Package Code
MLF
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Data Rate
100000 Mbps
JESD-30 Code
S-PQCC-N56
S-PBGA-B196
JESD-609 Code
e0
Length
8 mm
15 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
56
196
Number of Transceivers
1
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
BGA
Package Equivalence Code
LCC56,.31SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.75 mm
Supply Current-Max
0.16 mA
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
15 mm
Base Number Matches
1
1
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Compare 82562EZ with alternatives