1338C-31SRI8
vs
DS1339U-3+T&R
feature comparison
| Pbfree Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Part Package Code |
SOIC
|
SOIC
|
| Pin Count |
16
|
8
|
| Manufacturer Package Code |
PI16
|
|
| ECCN Code |
NLR
|
EAR99
|
| HTS Code |
8542390000
|
8542.39.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
|
LEAD FREE, MICRO, SOP-8
|
| Reach Compliance Code |
|
compliant
|
| Clock Frequency-Max |
|
0.032 MHz
|
| External Data Bus Width |
|
|
| Information Access Method |
|
SERIAL(I2C)
|
| Interrupt Capability |
|
Y
|
| JESD-30 Code |
|
S-PDSO-G8
|
| JESD-609 Code |
|
e3
|
| Length |
|
3 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
8
|
| Number of Timers |
|
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max |
|
3.3 V
|
| Supply Voltage-Min |
|
2.7 V
|
| Supply Voltage-Nom |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time-Min |
|
SECONDS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Volatile |
|
NO
|
| Width |
|
3 mm
|
| uPs/uCs/Peripheral ICs Type |
|
TIMER, REAL TIME CLOCK
|
|
|
|
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