11LC160T-I/MN
vs
11LC160T-E/MN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
DFN
Package Description
2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
JESD-609 Code
e4
e4
Length
3 mm
3 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2KX8
2KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
0.8 mm
0.8 mm
Serial Bus Type
1-WIRE
1-WIRE
Supply Current-Max
0.005 mA
0.005 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
2 mm
2 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
1
Compare 11LC160T-I/MN with alternatives
Compare 11LC160T-E/MN with alternatives