11AA020T-I/SN
vs
DS2430AX
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
|
CSP-2
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Factory Lead Time |
6 Weeks
|
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
|
| Data Retention Time-Min |
200
|
|
| Endurance |
1000000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDSO-G8
|
R-XUUC-N2
|
| JESD-609 Code |
e3
|
e0
|
| Length |
4.9 mm
|
|
| Memory Density |
2048 bit
|
256 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
8
|
2
|
| Number of Words |
256 words
|
32 words
|
| Number of Words Code |
256
|
32
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256X8
|
32X8
|
| Output Characteristics |
TOTEM POLE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
DIE
|
| Package Equivalence Code |
SOP8,.25
|
BGA4(UNSPEC)
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
NO
|
|
| Reverse Pinout |
NO
|
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.75 mm
|
|
| Serial Bus Type |
1-WIRE
|
1-WIRE
|
| Standby Current-Max |
0.000005 A
|
|
| Supply Current-Max |
0.005 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
2.8 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Toggle Bit |
NO
|
|
| Width |
3.9 mm
|
|
| Write Cycle Time-Max (tWC) |
10 ms
|
|
| Write Protection |
SOFTWARE
|
|
| Base Number Matches |
1
|
2
|
|
|
|
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