10M50DAF256C7P
vs
10M50DAF256A7P
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
FBGA-256
|
FBGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Number of CLBs |
3125
|
3125
|
Number of Inputs |
500
|
500
|
Number of Logic Cells |
50000
|
50000
|
Number of Outputs |
500
|
500
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
3125 CLBS
|
3125 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.55 mm
|
1.55 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL EXTENDED
|
AUTOMOTIVE
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 10M50DAF256C7P with alternatives
Compare 10M50DAF256A7P with alternatives