10M04DAF256I6G
vs
10M04DAF256C8G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
FBGA-256
|
17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e1
|
| Length |
17 mm
|
17 mm
|
| Number of CLBs |
250
|
250
|
| Number of Inputs |
246
|
246
|
| Number of Logic Cells |
4000
|
4000
|
| Number of Outputs |
246
|
246
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
250 CLBS
|
250 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1.55 mm
|
1.55 mm
|
| Supply Voltage-Max |
1.25 V
|
1.25 V
|
| Supply Voltage-Min |
1.15 V
|
1.15 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
2
|
2
|
| Samacsys Manufacturer |
|
Intel
|
| Moisture Sensitivity Level |
|
3
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 10M04DAF256I6G with alternatives
Compare 10M04DAF256C8G with alternatives