10H535M/B2AJC
vs
5962-87505012A
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
QCCN, LCC20,.35SQ
|
QCCN, LCC20,.35SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
S-XQCC-N20
|
S-XQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
| Max Frequency@Nom-Sup |
250000000 Hz
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC
|
| Package Code |
QCCN
|
QCCN
|
| Package Equivalence Code |
LCC20,.35SQ
|
LCC20,.35SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
75 mA
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
38535Q/M;38534H;883B
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Trigger Type |
MASTER-SLAVE
|
MASTER-SLAVE
|
| Base Number Matches |
3
|
3
|
|
|
|