10H535/BFAJC
vs
MC10H175MG
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ONSEMI
|
| Package Description |
DFP, FL14,.3
|
LEAD FREE, EIAJ, SOP-16
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-XDFP-F14
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Logic IC Type |
J-K FLIP-FLOP
|
D LATCH
|
| Max Frequency@Nom-Sup |
250000000 Hz
|
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
125 °C
|
75 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
SOP
|
| Package Equivalence Code |
FL14,.3
|
SOP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
75 mA
|
107 mA
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
MASTER-SLAVE
|
LOW LEVEL
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Family |
|
10H
|
| Length |
|
10.2 mm
|
| Number of Bits |
|
5
|
| Output Polarity |
|
TRUE
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
2.4 ns
|
| Propagation Delay (tpd) |
|
2 ns
|
| Seated Height-Max |
|
2.05 mm
|
| Width |
|
5.275 mm
|
|
|
|
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