10H531/BFAJC
vs
MC10H130FN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DFP
Package Description
DFP, FL16,.3
QCCJ, LDCC20,.4SQ
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
WITH ADDITIONAL COMMON CLOCK
Family
10H
JESD-30 Code
R-GDFP-F16
S-PQCC-J20
JESD-609 Code
e0
e0
Length
9.65 mm
Logic IC Type
D FLIP-FLOP
D LATCH
Max Frequency@Nom-Sup
250000000 Hz
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
16
20
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Characteristics
OPEN-EMITTER
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
QCCJ
Package Equivalence Code
FL16,.3
LDCC20,.4SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
CHIP CARRIER
Power Supply Current-Max (ICC)
62 mA
Propagation Delay (tpd)
2.2 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.15 mm
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Trigger Type
POSITIVE EDGE
Width
6.415 mm
fmax-Min
250 MHz
Base Number Matches
3
4
Prop. Delay@Nom-Sup
1.9 ns
Compare 10H531/BFAJC with alternatives