10631/BEAJC
vs
10135F
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
SIGNETICS CORP
|
| Package Description |
DIP, DIP16,.3
|
DIP-16
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-XDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
D FLIP-FLOP
|
JBAR-KBAR FLIP-FLOP
|
| Max Frequency@Nom-Sup |
200000000 Hz
|
125000000 Hz
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-30 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supplies |
-5.2 V
|
|
| Power Supply Current-Max (ICC) |
72 mA
|
68 mA
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ECL10K
|
ECL
|
| Temperature Grade |
MILITARY
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
MASTER-SLAVE
|
POSITIVE EDGE
|
| Base Number Matches |
3
|
4
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
WITH INDIVIDUAL SET AND RESET INPUTS
|
| Family |
|
10K
|
| Number of Bits |
|
2
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Output Polarity |
|
COMPLEMENTARY
|
| Propagation Delay (tpd) |
|
4.5 ns
|
|
|
|
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