10568/BFAJC
vs
MC10132L
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DFP, FL16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
INDIVIDUAL STROBED OUTPUTS
Family
10K
JESD-30 Code
R-GDFP-F16
R-XDIP-T16
JESD-609 Code
e0
e0
Length
9.65 mm
Logic IC Type
D LATCH
MULTIPLEXER
Number of Bits
4
Number of Functions
1
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-30 °C
Output Characteristics
OPEN-EMITTER
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DFP
DIP
Package Equivalence Code
FL16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Power Supply Current-Max (ICC)
83 mA
60 mA
Prop. Delay@Nom-Sup
6.6 ns
6.3 ns
Propagation Delay (tpd)
6.6 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.15 mm
Surface Mount
YES
NO
Technology
ECL
ECL10K
Temperature Grade
MILITARY
OTHER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
HIGH LEVEL
Width
6.415 mm
Base Number Matches
3
3
Number of Inputs
2
Power Supplies
-5.2 V
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