10173FC
vs
MC10186FN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DFP
|
|
| Package Description |
DFP,
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
FOUR 2:1 MUX FOLLOWED BY LATCH
|
|
| Family |
10K
|
|
| JESD-30 Code |
R-CDFP-F16
|
S-PQCC-J20
|
| Length |
9.906 mm
|
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Number of Bits |
4
|
|
| Number of Functions |
1
|
6
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
-30 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
QCCJ
|
| Package Equivalence Code |
FL16,.3
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
66 mA
|
121 mA
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.905 mm
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
| Terminal Form |
FLAT
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
LOW LEVEL
|
MASTER-SLAVE
|
| Width |
6.731 mm
|
|
| Base Number Matches |
1
|
5
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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