10132F
vs
MC10H131FNR2G
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ONSEMI
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TWO 2:1 MUX FOLLOWED BY LATCH
Family
10K
10H
JESD-30 Code
R-GDIP-T16
S-PQCC-J20
JESD-609 Code
e0
e3
Logic IC Type
D LATCH
D FLIP-FLOP
Number of Bits
2
2
Number of Functions
1
1
Number of Inputs
2
Number of Terminals
16
20
Operating Temperature-Max
85 °C
75 °C
Operating Temperature-Min
-30 °C
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP16,.3
LDCC20,.4SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Power Supply Current-Max (ICC)
55 mA
62 mA
Prop. Delay@Nom-Sup
6.3 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Technology
ECL
ECL
Temperature Grade
OTHER
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Trigger Type
LOW LEVEL
POSITIVE EDGE
Base Number Matches
4
1
Rohs Code
Part Package Code
QLCC
Package Description
LEAD FREE, PLASTIC, LCC-20
Pin Count
20
Manufacturer Package Code
775-02
ECCN Code
EAR99
Factory Lead Time
2 Days
Samacsys Manufacturer
onsemi
Length
8.965 mm
Max Frequency@Nom-Sup
250000000 Hz
Moisture Sensitivity Level
3
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
1.7 ns
Seated Height-Max
4.57 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
8.965 mm
fmax-Min
250 MHz
Compare 10132F with alternatives
Compare MC10H131FNR2G with alternatives