100B750JTN500XC100
vs
CDR14BG750EJUM
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
AMERICAN TECHNICAL CERAMICS CORP
|
AVX CORP
|
| Package Description |
CHIP
|
, 1111
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.24.00.20
|
8532.24.00.20
|
| Capacitance |
0.000075 µF
|
0.000075 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
2.59 mm
|
2.59 mm
|
| JESD-609 Code |
e3
|
e0
|
| Length |
2.79 mm
|
2.79 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
5%
|
5%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Positive Tolerance |
5%
|
5%
|
| Rated (AC) Voltage (URac) |
353.5 V
|
|
| Rated (DC) Voltage (URdc) |
500 V
|
500 V
|
| Size Code |
1111
|
1111
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
P90
|
BG
|
| Temperature Coefficient |
90+/-20ppm/Cel ppm/°C
|
90+/-20ppm/Cel ppm/°C
|
| Terminal Finish |
Tin (Sn)
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Width |
2.79 mm
|
2.79 mm
|
| Base Number Matches |
2
|
3
|
| Pbfree Code |
|
No
|
| Packing Method |
|
WAFFLE PACK
|
| Reference Standard |
|
MIL-PRF-55681/4/5
|
|
|
|
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