100B750JTN500XC100
vs
CDR13BG750EJZS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
KYOCERA AVX COMPONENTS CORP
AVX CORP
Package Description
CHIP
, 1111
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Factory Lead Time
16 Weeks
Capacitance
0.000075 µF
0.000075 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
2.59 mm
2.59 mm
JESD-609 Code
e3
e0
Length
2.79 mm
2.79 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
5%
5%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Style
SMT
SMT
Positive Tolerance
5%
5%
Rated (AC) Voltage (URac)
353.5 V
Rated (DC) Voltage (URdc)
500 V
500 V
Size Code
1111
1111
Surface Mount
YES
YES
Temperature Characteristics Code
BG
BG
Temperature Coefficient
90+/-20ppm/Cel ppm/°C
90+/-20ppm/Cel ppm/°C
Terminal Finish
Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
2.79 mm
2.79 mm
Base Number Matches
2
1
Packing Method
Waffle Pack
Reference Standard
MIL-PRF-55681
Compare 100B750JTN500XC100 with alternatives
Compare CDR13BG750EJZS with alternatives