100B750GPN500XC100
vs
CDR14BG750EGUP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
KYOCERA AVX COMPONENTS CORP
AVX CORP
Package Description
CHIP
, 1111
Reach Compliance Code
compliant
not_compliant
Capacitance
0.000075 µF
0.000075 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
2.59 mm
2.59 mm
JESD-609 Code
e0
e0
Length
2.79 mm
2.79 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
2%
2%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Style
SMT
SMT
Positive Tolerance
2%
2%
Rated (AC) Voltage (URac)
353.5 V
Rated (DC) Voltage (URdc)
500 V
500 V
Size Code
1111
1111
Surface Mount
YES
YES
Temperature Characteristics Code
BG
BG
Temperature Coefficient
90+/-20ppm/Cel ppm/°C
90+/-20ppm/Cel ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
2.79 mm
2.79 mm
Base Number Matches
1
1
Pbfree Code
ECCN Code
EAR99
HTS Code
8532.24.00.20
Packing Method
WAFFLE PACK
Reference Standard
MIL-PRF-55681/4/5
Compare 100B750GPN500XC100 with alternatives
Compare CDR14BG750EGUP with alternatives