100B111JW300XC100
vs
CDR13BG111DJNP
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
KYOCERA AVX COMPONENTS CORP
|
AVX CORP
|
Package Description |
CHIP
|
, 1111
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8532.24.00.20
|
8532.24.00.20
|
Capacitance |
0.00011 µF
|
0.00011 µF
|
Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
Dielectric Material |
CERAMIC
|
CERAMIC
|
Height |
2.59 mm
|
2.59 mm
|
JESD-609 Code |
e0
|
e4
|
Length |
2.79 mm
|
2.79 mm
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Multilayer |
Yes
|
Yes
|
Negative Tolerance |
5%
|
5%
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Style |
SMT
|
SMT
|
Positive Tolerance |
5%
|
5%
|
Rated (AC) Voltage (URac) |
212.1 V
|
|
Rated (DC) Voltage (URdc) |
300 V
|
300 V
|
Size Code |
1111
|
1111
|
Surface Mount |
YES
|
YES
|
Temperature Characteristics Code |
BG
|
BG
|
Temperature Coefficient |
90+/-20ppm/Cel ppm/°C
|
90+/-20ppm/Cel ppm/°C
|
Terminal Finish |
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
Silver/Nickel/Gold (Ag/Ni/Au)
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Width |
2.79 mm
|
2.79 mm
|
Base Number Matches |
2
|
2
|
Packing Method |
|
WAFFLE PACK
|
Reference Standard |
|
MIL-PRF-55681/4/5
|
|
|
|
Compare 100B111JW300XC100 with alternatives
Compare CDR13BG111DJNP with alternatives