100A0R6BTN150XC100
vs
CDR12BG0R6KBSS
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
KYOCERA AVX COMPONENTS CORP
|
AVX CORP
|
| Package Description |
CHIP
|
, 0606
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Capacitance |
6e-7 µF
|
6e-7 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
1.45 mm
|
1.45 mm
|
| JESD-609 Code |
e3
|
e0
|
| Length |
1.4 mm
|
1.4 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
16.6667%
|
16.6667%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Positive Tolerance |
16.6667%
|
16.6667%
|
| Rated (AC) Voltage (URac) |
106.05 V
|
|
| Rated (DC) Voltage (URdc) |
150 V
|
150 V
|
| Size Code |
0505
|
0505
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
BG
|
BG
|
| Temperature Coefficient |
90+/-20ppm/Cel ppm/°C
|
90+/-20ppm/Cel ppm/°C
|
| Terminal Finish |
Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Width |
1.4 mm
|
1.4 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8532.24.00.20
|
| Packing Method |
|
WAFFLE PACK
|
| Reference Standard |
|
MIL-PRF-55681/4/5
|
|
|
|
Compare 100A0R6BTN150XC100 with alternatives
Compare CDR12BG0R6KBSS with alternatives