100355QIX
vs
100355QI
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
QCCJ,
|
QCCJ, LDCC28,.5SQ
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
FOUR 2:1 MUX FOLLOWED BY LATCH
|
FOUR 2:1 MUX FOLLOWED BY LATCH; WITH DUAL LATCH ENABLE; OPTEMP SPECIFIED AS TC
|
Family |
100K
|
100K
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
Length |
11.43 mm
|
11.48 mm
|
Logic IC Type |
D LATCH
|
D LATCH
|
Number of Bits |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Propagation Delay (tpd) |
2 ns
|
2.7 ns
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Trigger Type |
LOW LEVEL
|
LOW LEVEL
|
Width |
11.43 mm
|
11.48 mm
|
Base Number Matches |
2
|
4
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Load Capacitance (CL) |
|
3 pF
|
Number of Inputs |
|
2
|
Package Equivalence Code |
|
LDCC28,.5SQ
|
Power Supply Current-Max (ICC) |
|
87 mA
|
Prop. Delay@Nom-Sup |
|
1.8 ns
|
Qualification Status |
|
Not Qualified
|
Screening Level |
|
MIL-STD-883 Class B
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|