100331FMQB
vs
100156DC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
QFF, QFL24,.4SQ
|
DIP, DIP24,.4
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH ADDITIONAL COMMON CLOCK, SET AND RESET INPUTS; OPTEMP SPECIFIED AS TC
|
2:1 MASK MERGE LATCH
|
| Family |
100K
|
100K
|
| JESD-30 Code |
S-GQFP-F24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.398 mm
|
|
| Load Capacitance (CL) |
3 pF
|
3 pF
|
| Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
| Max Frequency@Nom-Sup |
400000000 Hz
|
|
| Number of Bits |
1
|
4
|
| Number of Functions |
3
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QFF
|
DIP
|
| Package Equivalence Code |
QFL24,.4SQ
|
DIP24,.4
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
130 mA
|
235 mA
|
| Prop. Delay@Nom-Sup |
2.5 ns
|
|
| Propagation Delay (tpd) |
2.4 ns
|
2.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
2.159 mm
|
5.72 mm
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
MILITARY
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
LOW LEVEL
|
| Width |
9.398 mm
|
10.16 mm
|
| fmax-Min |
400 MHz
|
|
| Base Number Matches |
5
|
4
|
|
|
|
Compare 100331FMQB with alternatives
Compare 100156DC with alternatives