1.5SMC9.1AHV7G
vs
MXSMCJ8.0A
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Additional Feature |
EXCELLENT CLAMPING CAPABILITY
|
HIGH RELIABILITY
|
| Breakdown Voltage-Max |
9.55 V
|
9.83 V
|
| Breakdown Voltage-Min |
8.65 V
|
8.89 V
|
| Breakdown Voltage-Nom |
9.1 V
|
|
| Clamping Voltage-Max |
13.4 V
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| Forward Voltage-Max (VF) |
3.5 V
|
|
| JEDEC-95 Code |
DO-214AB
|
DO-214AB
|
| JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Peak Rev Power Dis-Max |
1500 W
|
1500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
6.5 W
|
1.56 W
|
| Reference Standard |
AEC-Q101; IEC-61249-2-21
|
MIL-19500
|
| Rep Pk Reverse Voltage-Max |
7.78 V
|
8 V
|
| Reverse Current-Max |
50 µA
|
|
| Reverse Test Voltage |
7.78 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
C BEND
|
C BEND
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
2
|
| Package Description |
|
PLASTIC, SMCJ, 2 PIN
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 1.5SMC9.1AHV7G with alternatives
Compare MXSMCJ8.0A with alternatives