0805W8F4701T5E
vs
MCR10EZHF4701
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROYAL ELECTRONIC FTY CO LTD
ROHM CO LTD
Package Description
CHIP
CHIP
Reach Compliance Code
unknown
compliant
Samacsys Manufacturer
ROYALOHM
ROHM Semiconductor
Construction
Rectangular
Chip
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
2 mm
2 mm
Package Style
SMT
SMT
Package Width
1.25 mm
1.25 mm
Packing Method
TR, PAPER, 7 INCH
TR, PAPER, 7 INCH
Rated Power Dissipation (P)
0.125 W
0.125 W
Rated Temperature
70 °C
70 °C
Resistance
4700 Ω
4700 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0805
0805
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
150 V
150 V
Base Number Matches
1
1
Rohs Code
Yes
ECCN Code
EAR99
HTS Code
8533.21.00.30
Package Shape
RECTANGULAR PACKAGE
Compare 0805W8F4701T5E with alternatives
Compare MCR10EZHF4701 with alternatives