Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
IGC27T120T6LX1SA3
DISTI #
IGC27T120T6LX1SA3
|
Infineon Technologies AG | IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC27T120T6LX1SA3) RoHS: Compliant Min Qty: 134 Package Multiple: 1 Container: Waffle Pack IGC27T120T6LX1SA3 Part Details | 0 | RFQ IGC27T120T6LX1SA3 Part Details |