Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
371824B00032G
DISTI #
18M8050
|
Boyd Corporation | Heat Sink, Thermal Resistance:31.9°C/W, Packages Cooled:Bga, External Width - Metric:35Mm, External Height - Metric:7.01Mm, External Length - Metric:35Mm, External Diameter - Metric:-, Heat Sink Material:Aluminum, Product Range:- Rohs Compliant: Yes |Boyd 371824B00032G RoHS: Compliant Min Qty: 1728 Package Multiple: 1 Date Code: 0 Container: Bulk 371824B00032G Part Details | 0 |
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$2.6800 | Buy Now 371824B00032G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
371824B00032G
DISTI #
HS392-ND
|
BOYD Laconia | HEATSINK BGA W/ADHESIVE TAPE Min Qty: 1 Lead time: 14 Weeks Container: Tray 371824B00032G Part Details |
1197 In Stock |
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$5.0282 / $6.1700 | Buy Now 371824B00032G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
371824B00032G
DISTI #
042600
|
Boyd Corporation | Heat Sink Passive BGA Pin Array Tape Black Anodized - Bulk (Alt: 042600) RoHS: Compliant Min Qty: 864 Package Multiple: 1 Lead time: 14 Weeks, 0 Days Container: Bulk 371824B00032G Part Details | 0 |
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Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
371824B00032G
DISTI #
532-371824B32G
|
BOYD Laconia | Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black, 35x35x7mm, IC=35x35, Tape #32 RoHS: Compliant 371824B00032G Part Details | 1531 |
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$2.2500 / $3.0400 | Buy Now 371824B00032G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
371824B00032G
DISTI #
V36:1790_07570701
|
Boyd Corporation | Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9°C/W Black Anodized RoHS: Compliant Min Qty: 59 Package Multiple: 1 Lead time: 14 Weeks Date Code: 2333 371824B00032G Part Details | Americas - 561 |
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Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
371824B00032G
DISTI #
71076907
|
Boyd Corporation | Heatsink, Metal/Ceramic BGA Packages, 31.9degC/W, 35 x 35 x 7mm, Surface Mount | Boyd 371824B00032G RoHS: Not Compliant Min Qty: 864 Package Multiple: 1 Container: Bulk 371824B00032G Part Details | 896 |
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$3.2400 | Buy Now 371824B00032G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
BOYD Laconia | RoHS: Compliant 371824B00032G Part Details | 0 |
|
$2.1800 / $5.9800 | Buy Now 371824B00032G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
371824B00032G
DISTI #
69782964
|
Boyd Corporation | Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9°C/W Black Anodized RoHS: Compliant Min Qty: 59 Package Multiple: 1 Date Code: 2333 371824B00032G Part Details | Americas - 561 |
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8 |
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$3.1027 / $4.2309 | Buy Now |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
371824B00032G
DISTI #
371824B00032G
|
Boyd Corporation | Heatsink: extruded, grilled, BGA,FPGA, black, L: 35mm, W: 35mm, H: 7mm Min Qty: 864 371824B00032G Part Details | 0 |
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$2.4300 | RFQ 371824B00032G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
371824B00032G
DISTI #
042600
|
Boyd Corporation | Heat Sink Passive BGA Pin Array Tape Black Anodized (Alt: 042600) RoHS: Compliant Min Qty: 1728 Package Multiple: 864 Lead time: 18 Weeks, 0 Days 371824B00032G Part Details | Abacus - 0 | Buy Now 371824B00032G Part Details |