Datasheets
XC7Z007S-1CLG400C by:

Multifunction Peripheral, CMOS, PBGA400, BGA-400

Part Details for XC7Z007S-1CLG400C by AMD Xilinx

Overview of XC7Z007S-1CLG400C by AMD Xilinx

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Applications Industrial Automation Renewable Energy Robotics and Drones

Price & Stock for XC7Z007S-1CLG400C

Part # Distributor Description Stock Price Buy
DISTI # 32AC9830
Newark Psoc, Arm Cortex-A9, 667Mhz, Bga-400, Product Range:Zynq Family 7000S Series Microprocessors, Cpu Speed:667Mhz, Core Architecture:Arm Cortex-A9, Mpu Case Style:Bga, No. Of Pins:400Pins, Msl:-, Ic Case/Package:Bga Rohs Compliant: Yes |Amd Xilinx XC7Z007S-1CLG400C Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk 142
  • 1 $67.7800
$67.7800 Buy Now
Win Source Electronics IC SOC CORTEX-A9 667MHZ 400BGA 12763
  • 3 $21.1960
  • 6 $17.3920
  • 9 $16.8480
  • 13 $16.3050
  • 16 $15.7610
  • 22 $14.1310
$14.1310 / $21.1960 Buy Now

Part Details for XC7Z007S-1CLG400C

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XC7Z007S-1CLG400C Part Data Attributes:

XC7Z007S-1CLG400C AMD Xilinx
Buy Now Datasheet
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XC7Z007S-1CLG400C AMD Xilinx Multifunction Peripheral, CMOS, PBGA400, BGA-400
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description CSBGA-400
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 65 Weeks
Date Of Intro 2017-06-07
JESD-30 Code S-PBGA-B400
Length 17 mm
Number of Terminals 400
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA400,20X20,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Seated Height-Max 1.6 mm
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.95 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 17 mm
uPs/uCs/Peripheral ICs Type SoC

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