Part Details for XC226456F66LACKXUMA1 by Infineon Technologies AG
Overview of XC226456F66LACKXUMA1 by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for XC226456F66LACKXUMA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC226456F66LACKXUMA1TR-ND
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DigiKey | IC MCU 16/32B 448KB FLSH 100LQFP Lead time: 12 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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Buy Now | |
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DISTI #
XC226456F66LACKXUM
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Avnet Americas | MCU 16-Bit/32-Bit XC2000 C166 CISC/DSP/RISC 448KB Flash 3.3V/5V 100-Pin LQFP T/R - Tape and Reel (Alt: XC226456F66LACKXUM) RoHS: Not Compliant Min Qty: 1400 Package Multiple: 1 Container: Reel | 0 |
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RFQ |
Part Details for XC226456F66LACKXUMA1
XC226456F66LACKXUMA1 CAD Models
XC226456F66LACKXUMA1 Part Data Attributes:
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XC226456F66LACKXUMA1
Infineon Technologies AG
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Datasheet
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XC226456F66LACKXUMA1
Infineon Technologies AG
Microcontroller, 32-Bit, FLASH, 66MHz, CMOS, PQFP100, 0.50 MM PITCH, GREEN, PLASTIC, LQFP-100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | HLFQFP, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G100 | |
| Length | 14 mm | |
| Number of I/O Lines | 73 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 1.6 V | |
| Supply Voltage-Min | 1.4 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |