Part Details for XC17V08VQ44I by Rochester Electronics LLC
Overview of XC17V08VQ44I by Rochester Electronics LLC
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Part Details for XC17V08VQ44I
XC17V08VQ44I CAD Models
XC17V08VQ44I Part Data Attributes
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XC17V08VQ44I
Rochester Electronics LLC
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Datasheet
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XC17V08VQ44I
Rochester Electronics LLC
1MX8 CONFIGURATION MEMORY, PQFP44, PLASTIC, QFP-44
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | QFP | |
| Package Description | TQFP, | |
| Pin Count | 44 | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PQFP-G44 | |
| JESD-609 Code | e0 | |
| Length | 10 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 44 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE | |
| Parallel/Serial | PARALLEL/SERIAL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 10 mm |