Datasheets
N25Q256A13E1241E by: Micron Technology Inc

Flash, 256MX1, PBGA24, TBGA-24

Part Details for N25Q256A13E1241E by Micron Technology Inc

Overview of N25Q256A13E1241E by Micron Technology Inc

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Part Details for N25Q256A13E1241E

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N25Q256A13E1241E Part Data Attributes:

N25Q256A13E1241E Micron Technology Inc
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N25Q256A13E1241E Micron Technology Inc Flash, 256MX1, PBGA24, TBGA-24
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description TBGA-24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Samacsys Manufacturer Micron
Clock Frequency-Max (fCLK) 108 MHz
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24
Length 8 mm
Memory Density 268435456 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA24,5X5,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL
Programming Voltage 3 V
Seated Height-Max 1.2 mm
Serial Bus Type QSPI
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE

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