Part Details for LPC4337JET256 by NXP Semiconductors
Overview of LPC4337JET256 by NXP Semiconductors
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for LPC4337JET256
LPC4337JET256 CAD Models
LPC4337JET256 Part Data Attributes
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LPC4337JET256
NXP Semiconductors
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Datasheet
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LPC4337JET256
NXP Semiconductors
32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | 24 | |
Bit Size | 32 | |
CPU Family | CORTEX-M4 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B256 | |
Length | 17 mm | |
Moisture Sensitivity Level | 4 | |
Number of I/O Lines | 164 | |
Number of Terminals | 256 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
RAM (bytes) | 139264 | |
ROM (words) | 1048576 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.55 mm | |
Speed | 204 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |