Part Details for GE28F008B3BA90 by Rochester Electronics LLC
Overview of GE28F008B3BA90 by Rochester Electronics LLC
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- Part Data Attributes: (Available)
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Part Details for GE28F008B3BA90
GE28F008B3BA90 CAD Models
GE28F008B3BA90 Part Data Attributes:
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GE28F008B3BA90
Rochester Electronics LLC
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GE28F008B3BA90
Rochester Electronics LLC
1M X 8 FLASH 2.7V PROM, 90 ns, PBGA46, VFBGA-46
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS INC | |
| Part Package Code | BGA | |
| Package Description | VFBGA, | |
| Pin Count | 46 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 90 ns | |
| Additional Feature | BOTTOM BOOT BLOCK | |
| JESD-30 Code | R-PBGA-B46 | |
| JESD-609 Code | e0 | |
| Length | 7.91 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | NOT SPECIFIED | |
| Number of Functions | 1 | |
| Number of Terminals | 46 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 2.7 V | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 6.5 mm |