Datasheets
DS1004C-303 by: Maxim Integrated Products

Silicon Delay Line, 1-Func, 5-Tap, True Output, CMOS, PDIP8, 0.300 INCH, PLASTIC, MS-001AB, DIP-8

Part Details for DS1004C-303 by Maxim Integrated Products

Results Overview of DS1004C-303 by Maxim Integrated Products

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DS1004C-303 Information

DS1004C-303 by Maxim Integrated Products is a Delay Line.
Delay Lines are under the broader part category of Logic Components.

Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.

Price & Stock for DS1004C-303

Part # Distributor Description Stock Price Buy
DISTI # 2156-DS1004C-303-ND
DigiKey 5-TAP HIGH SPEED DELAY LINE Min Qty: 258 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT 392
In Stock
  • 258 $1.1600
$1.1600 Buy Now
Rochester Electronics DS1004 5-Tap High Speed Silicon Delay Line RoHS: Not Compliant Status: Obsolete Min Qty: 1 392
  • 1 $1.1200
  • 25 $1.1000
  • 100 $1.0500
  • 500 $1.0100
  • 1,000 $0.9520
$0.9520 / $1.1200 Buy Now

Part Details for DS1004C-303

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DS1004C-303 Part Data Attributes

DS1004C-303 Maxim Integrated Products
Buy Now Datasheet
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DS1004C-303 Maxim Integrated Products Silicon Delay Line, 1-Func, 5-Tap, True Output, CMOS, PDIP8, 0.300 INCH, PLASTIC, MS-001AB, DIP-8
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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, MS-001AB, DIP-8
Pin Count 8
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family CMOS
JESD-30 Code R-PDIP-T8
JESD-609 Code e0
Length 9.375 mm
Logic IC Type SILICON DELAY LINE
Number of Functions 1
Number of Taps/Steps 5
Number of Terminals 8
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) 240
Programmable Delay Line NO
Qualification Status Not Qualified
Seated Height-Max 4.572 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 7.62 mm

DS1004C-303 Frequently Asked Questions (FAQ)

  • Maxim provides a recommended PCB layout in the datasheet, but it's also important to follow general high-speed PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines. Additionally, it's recommended to place the device near the connector to minimize signal degradation.

  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and keeping the device within its specified operating temperature range. Additionally, consider using a thermally enhanced package or a heat sink to reduce the junction temperature.

  • When using the DS1004C-303 in a system with multiple clock domains, it's essential to ensure that the clock signals are properly synchronized and buffered to prevent clock domain crossing issues. This may require the use of clock domain crossing circuits or FIFOs to ensure data integrity and prevent metastability issues.

  • To troubleshoot issues with the DS1004C-303, start by reviewing the datasheet and application notes to ensure that the device is properly configured and used within its specified operating conditions. Use oscilloscopes and logic analyzers to debug signal integrity issues, and consider using simulation tools to model the system and identify potential issues. Additionally, consult with Maxim's technical support team for further assistance.

  • When using the DS1004C-303 in a system, it's essential to consider EMI and RFI effects, such as radiated emissions and conducted emissions. Follow proper PCB design and layout guidelines, use shielding and filtering techniques, and consider using EMI-absorbing materials to minimize emissions. Additionally, ensure that the system meets relevant regulatory requirements, such as FCC and CE marks.