Part Details for CY14B116N-BA25XI by Cypress Semiconductor
Results Overview of CY14B116N-BA25XI by Cypress Semiconductor
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CY14B116N-BA25XI Information
CY14B116N-BA25XI by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for CY14B116N-BA25XI
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
2156-CY14B116N-BA25XI-ND
|
DigiKey | IC NVSRAM 16MBIT PARALLEL 60FBGA Min Qty: 5 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
26 In Stock |
|
$72.8000 | Buy Now |
DISTI #
86102531
|
Verical | NVRAM NVSRAM Parallel 16Mbit 3V/3.3V 60-Pin FBGA Tray RoHS: Compliant Min Qty: 5 Package Multiple: 1 Date Code: 1601 | Americas - 26 |
|
$87.5000 | Buy Now |
|
Rochester Electronics | Non-Volatile SRAM, 1MX16, 25ns PBGA60 RoHS: Compliant pbFree: No Status: Active Min Qty: 1 | 26 |
|
$59.5000 / $70.0000 | Buy Now |
|
Flip Electronics | Stock | 2128 |
|
RFQ |
Part Details for CY14B116N-BA25XI
CY14B116N-BA25XI CAD Models
CY14B116N-BA25XI Part Data Attributes
|
CY14B116N-BA25XI
Cypress Semiconductor
Buy Now
Datasheet
|
Compare Parts:
CY14B116N-BA25XI
Cypress Semiconductor
Non-Volatile SRAM, 1MX16, 25ns, CMOS, PBGA60, 10 X 18 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, FBGA-60
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Reach Compliance Code | compliant | |
ECCN Code | 3A001.A.2 | |
HTS Code | 8542.90.00.00 | |
Date Of Intro | 2016-07-22 | |
Access Time-Max | 25 ns | |
JESD-30 Code | R-PBGA-B60 | |
JESD-609 Code | e1 | |
Length | 18 mm | |
Memory Density | 16777216 bit | |
Memory IC Type | NON-VOLATILE SRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 60 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Width | 10 mm |