Part Details for AT91SAM9M10C-CU by Atmel Corporation
Overview of AT91SAM9M10C-CU by Atmel Corporation
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Part Details for AT91SAM9M10C-CU
AT91SAM9M10C-CU CAD Models
AT91SAM9M10C-CU Part Data Attributes:
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AT91SAM9M10C-CU
Atmel Corporation
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Datasheet
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AT91SAM9M10C-CU
Atmel Corporation
RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA324, 0.80 MM PITCH, GREEN, MO-210, TFBGA-324
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA324,18X18,32 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Microchip | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 12 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B324 | |
| Length | 15 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Speed | 400 MHz | |
| Supply Current-Max | 120 mA | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 0.9 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |