Part Details for ML22660TBZ0BX by LAPIS Semiconductor Co Ltd
Overview of ML22660TBZ0BX by LAPIS Semiconductor Co Ltd
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Healthcare
Electronic Manufacturing
Price & Stock for ML22660TBZ0BX
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
84AH7308
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Newark | Mixing Speech Synthesis Lsi, -40To85Degc Rohs Compliant: Yes |Lapis Semiconductor ML22660TBZ0BX Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 42 |
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$3.3700 / $7.5600 | Buy Now |
Part Details for ML22660TBZ0BX
ML22660TBZ0BX CAD Models
ML22660TBZ0BX Part Data Attributes
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ML22660TBZ0BX
LAPIS Semiconductor Co Ltd
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Datasheet
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ML22660TBZ0BX
LAPIS Semiconductor Co Ltd
Speech Synthesizer, 5240s, PQFP32, TQFP-32
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | LAPIS SEMICONDUCTOR CO LTD | |
Package Description | TQFP-32 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Additional Feature | ALSO OPERATE FROM 3.3V TO 5.5V | |
Application | VOICE SYNTHESIS | |
Consumer IC Type | SPEECH SYNTHESIZER | |
JESD-30 Code | S-PQFP-G32 | |
Length | 7 mm | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
On Chip Memory Type | FLASH | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HTQFP | |
Package Equivalence Code | TQFP32,.3SQ,32 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, THIN PROFILE | |
Reading Time-Max | 5240 s | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.8 mm | |
Terminal Position | QUAD | |
Width | 7 mm |